Semiconductor assembly equipment Wire Bonder FB-900
Further evolved, speed and stability.
This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.
- 企業：カイジョー ODM事業部
- 価格：Other
Equipment development services×カイジョー - メーカー・企業と製品の一覧
Equipment development servicesの製品一覧
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Semiconductor assembly device Wire bonder FB-880
Realizing joining technology for new fields
Operator-friendly, stable, full-auto wire bonder.
- 企業：カイジョー ODM事業部
- 価格：Other
Wire Bonder - Fully Automatic Wire Bond
Achieve high productivity with UPH25000!
Wire bond for discrete and small pin applications that meets the demands for diverse packaging and fine pad pitch.
- 企業：カイジョー ODM事業部
- 価格：Other
Semiconductor assembly equipment Wire Bonder FB-780
Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.
Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.
- 企業：カイジョー ODM事業部
- 価格：Other
